Inline Solder Paste PCBA 3D Optical Inspection
AIS63X-HW
Multi-directional structured light imaging generates high-precision 3D images
Fusion AI intelligent denoising, real restoration of solder paste imaging
Strong anti-interference, high detection, low false positives
High precision imaging scheme,
AI intelligent denoising is integrated to restore the real and objective solder paste imaging. The specially developed light source scheme makes SPI adapt to the identification of PCB pads of different colors and materials, and improves the imaging accuracy.
Simple and easy to learn programming
AI intelligent programming, one click to generate the whole board image, intelligent configuration parameters, does not rely on engineer experience, higher program consistency.
Three-point lighting, assist to quickly locate abnormal causes
Integrate the inspection data of SPI, pre-furnace AOI and post-furnace AOI, quickly analyze product defects, locate the root cause, improve the situation of defective products and increase the yield of good products in the production line.
Inspection case
Specification
5Mp
Camera
36*30mm
FOV
15um
Resolution
Measurable board size
50*50mm-510*460mm
Camera
5Mp color high speed camera.
Light Source
RGB Three color integral light source+ single optical source for projection
FOV
36mm*30mm
Resolution
15um
Industrial Computer
CPU：Intel i7
Graphics：Nvidia GTX1050Ti
Memory：32G DDR4
Storage：256G SSD + 2T HDD
Network：1000M network card
Graphics：Nvidia GTX1050Ti
Memory：32G DDR4
Storage：256G SSD + 2T HDD
Network：1000M network card
Display
23.8 inch
Operating System
Ubuntu 18.04 LTS 64bit
Dimension and Weight
(L*H*W)1058*1669*1280mm，807Kg
Power Supply and Power
AC 220V. Rated power 510W
Environmental Requirements
Temperature: 10~45℃. Humidity: 30~85%RH
Note: The above parameters are standard configurations. If there are special requirements, they can be evaluated and customized. The information is for reference only. If there are any changes, the actual product shall prevail.
