Inline PCBA Double-sided Optical Inspection
AIS50X-HW
Multi-dimensional extraction of tens of thousands of features, bad detection ability
Special research light source and algorithm to meet the needs of special device detection
Final inspection after reflow soldering, after DIP wave soldering, or before packaging
Specially developed light source system, better imaging effect
Independently developed multi-channel light source, compatible with devices, patches, solder joints and other different detection items. Combined with AI intelligent seamless jigsaw technology, shooting stitching is more natural.
Strong ability to detect and identify complex projects
The model based on big data training is compatible with complex conditions such as device deviation, capacitor skew, solder joint shape change, similar color, irregular arrangement of devices, etc., and has strong detection ability.
Special research CPU pin matching algorithm
Special light source to improve the pin imaging effect, combined with the CPU pin matching algorithm, 1 minute to complete the entire CPU pin programming, covering of bad type detection.
Inspection case
Specification