Inline THT Solder Automated Optical Inspection
AIS30X-HW
AI-powered algorithms covering a wide range of solder inspection criteria
Intelligent programming for rapid identification of solder joints across the entire board
Extracts defect features of voids from multiple dimensions, ensuring high resistance to interference
Professional multi-color integral light source
Different angles of RGB light source irradiation, accurately reflect the slope information of the surface of the object, so that the solder joint layer is more obvious, clearly showing the solder defects.
AI zhìnéng suànfǎ, zhìnéng shìbié zhěng bǎn hàn diǎn jīyú dà shùjù +AI shēndù xuéxí suànfǎ xùnliàn, shíxiàn zhěng bǎn hàn diǎn zhìnéng shìbié, bìng pèizhì jiǎncè suànfǎ, tiáojié cānshù. 57 AI-powered algorithms for intelligent recognition of solder joints across an entire board
Based on big data +AI deep learning algorithm training, realizing Intelligent identification of solder joints of the whole board, and configuring detection algorithms to adjust parameters.
Stable identification of complex items
The model based on big data training, which can correct the alarm caused by the diversified deviation of solder joints, and solve the problem of missing and false alarm caused by the large change of solder joints components and the easy effected of pins and devices.
Inspection case
Specification