Inline THT Solder Automated Optical Inspection
AIS30X-HW
AI intelligent algorithm,
covering various solder detection items
covering various solder detection items
Minimal programming,
automatic identification of solder joints throughout the board
automatic identification of solder joints throughout the board
Multi-dimensional extraction of bad features of holes, strong detection ability
Professional multi-color integral light source
Different angles of RGB light source irradiation, accurately reflect the slope information of the surface of the object, so that the solder joint layer is more obvious, clearly showing the solder defects.
Automatically identifies the solder joints of the whole board
Based on big data +AI deep learning algorithm training, covering more than 97% of solder joint models, realizing automatic identification of solder joints of the whole board, and configuring detection algorithms to automatically adjust parameters.
Stable identification of complex items
The model based on big data training, which can correct the alarm caused by the diversified deviation of solder joints, and solve the problem of missing and false alarm caused by the large change of solder joints components and the easy effected of pins and devices.
Inspection case
Specification